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Packaging Engineer – Electrical - Chandler, Arizona
Intel Corporation
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Intel Corporation has an opening for a Packaging Engineer – Electrical in Chandler, Arizona. Duties: Emphasis in the electrical design and development of semiconductor technology, including signal processing, power, and control systems. Design and develop product packaging and provide ongoing engineering support for integrated circuit or semiconductor assemblies. Define overall package performance and specification. Ensure technology certification through layout design and test vehicle design. Conduct tests, research, and evaluate specifications on basic materials and properties. Establish material specifications for contract assemblers and raw material vendors and interface with Quality Assurance and Purchasing groups regarding materials. Provide consultation concerning packaging problems and improvements in the packaging process. Job duties may involve increased levels of responsibility over time. Salary: $ 85,966.00 - $ 148,200.00. Schedule: Monday – Friday, 8 AM – 5 PM. Standard Corporate Benefits. Minimum Requirements: Masters degree in Electrical &/or Computer Engineering, or Science, or related Science, or Engineering Discipline. The following skills are required for the role: Analog Circuit Design; Circuit Design; Circuit Simulation; Design; RF Engineering; and VLSI Circuit Design. Submit Resumes to: Recruitment and Employment Office, INTEL CORPORATION, Attn: Job Ref #: INT86502, P.O. Box 56625, Atlanta, GA 30343.
Primary Skills: MS
Salary: Between -
Experience Required: 0, years minimum
Clearance Level: 0
Travel: %
Other Details:
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