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Dry Etch Process Development Engineer - Boise, Idaho
Micron Technology, Inc.
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Micron Technology, Inc., has an opening for a Dry Etch Process Development Engineer in Boise, Idaho, located at 8000 S. Federal Way, Boise, Idaho 83716.
As a Dry Etch Process Development Engineer at Micron Technology, Inc., you must be willing and able to travel within the U.S. and internationally for brief business purposes. You will design and optimize plasma etch processes for Micron's leading edge memory. You will take ideas from conception through process development then implementation in our production facilities. This role is critical to the success of Micron's products and may require travel to Micron manufacturing sites. Primary areas of responsibility include plasma dry etch process characterization, optimization, design, troubleshooting, process transfer and fundamental research. Dry Etch Process Development Engineers interact with groups such as process integration, electrical failure analysis, yield enhancement, manufacturing, and equipment vendors to ensure robust etch processes that meet the precise physical and electrical requirements for Micron products. Engineers are responsible to identify and test new gas chemistries and equipment for sub-100nm features of dielectric, conductor, and Silicon trench applications.
Successful candidates for this position must have:
• The ability to work with vendors to improve existing tool performance and reliability. This requires knowledge of tool hardware effects on process performance and alternative ways to improve the hardware.
• The ability to compare Etch performance between different tools and offer recommendations for tool purchases to management. Must have demonstrated the ability to analyze complicated process results and explore different tool parameter spaces.
• The ability to develop Dry Etch processes to meet the device functionality requirements. This requires an understanding of plasma systems and the basic etch chemistries used to etch films in microelectronics fabrication.
• Must be able to clearly communicate with Process Integration Engineers and other Development group engineers on etch requirements to make the outcome successful.
• Must be willing to work weekends or evenings, if necessary.
• Must be willing and able to travel within the U.S. and internationally for brief business purposes.
Resume and/or cover letter must reflect each requirement above or it will be rejected. Upon hire, all applicants will be subject to drug testing/screening and background checks.
Hours of work: Usually 8 a.m. to 5 p.m., Monday through Friday -also must be willing to work
weekends or evenings, if necessary. Required: MS or equivalent foreign education in Electrical, Electronics, Materials, Mechanical or Chemical Engineering; or Physics – all with Microsystems/Microtechnology/Nanotechnology emphasis. Experience: None. Salary: $104,000. Brief orientation training provided. Benefits include health, life and disability insurance, 401(k), and time-off plan. Submit Resumes to: Recruitment and Employment Office, Micron Technology, Inc., Attn: Job Ref #: MIC40982, P.O. Box 56625, Atlanta, GA 30343
Primary Skills: -
Salary: Between - -
Experience Required: Entry level, 0 years minimum
Clearance Level: none
Travel: %
Other Details:
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